Jigs for semiconductor components

ABSTRACT

The present invention relates to a testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

FIELD OF THE INVENTION

[0001] The present invention generally relates to a jig forsemiconductor components in the ball grid array (BAG) packaging, andmore specifically to a testing jig employed in the Flip-Chip BGA baseboard to prevent chips from contacting with external force or foreignobjects during testing.

BACKGROUND OF THE INVENTION

[0002] For prior art of the plastic BGA packaging, the semiconductorbase board is protected by a layer of molding compound coating, so thechip under test is not susceptible to damages. However, the new productat present time is the base board packaged by the Flip-Chip BAG (FCBAG);the chip is bare, without the protection of the molding compound. If thetraditional tools press down during test, the direct contact will damagethe chip under test. Consequently, the object of the present inventionis to prevent the chip from being damaged by external force or by thecontact of foreign objects during test.

[0003] Static-Electricity is omnipresent, which may occur when twoobjects of different substances being rubbed together. The internalelectric circuit in chips will be affected by the instantaneous highvoltage which arises from contacting the objects withstatic-electricity. The damage caused by the Electro-Static Discharge(ESD) is the main potential factor in causing the failure of theelectronic system. Consequently, the present invention also aims toavoid unnecessary contact between the chip and the testing set, and thusreduce the occurrence of ESD.

SUMMARY OF THE INVENTION

[0004] The primary object of the present invention is to provide a jigfor semiconductor components which can enhance the success rate ofproduction, wherein the main function is to prevent the contact betweenthe main jig body and the chip in the center of the base board when themain jig body lifting the FCBGA base board. Consequently, no damage inthe chip would occur when the jig retrieving or pressing during test andthus the success rate of production can be enhanced.

[0005] The second object of the present invention is to provide a jigfor semiconductor components which is equipped with the function ofpreventing static-electricity, wherein no contact occurs between thechip and all other objects when the main jig body lifting the FCBGA baseboard or conducting test. Consequently, the possibility of inducingstatic-electricity can be reduced, thereby procuring the function ofpreventing of static-electricity.

[0006] The inventor will further elaborate the prevent invention withreference to the following figures and detailed descriptions, so as tofacilitate better understanding the procedures and the details of thepresent invention for the reviewers.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007]FIG. 1 is a top perspective view of the present invention.

[0008]FIG. 2 is a cross-sectional view taken through A-A line of FIG. 1with an addition of the base board on the bottom.

[0009]FIG. 3 is a top view of the present invention.

[0010]FIG. 4 is an exploded perspective view of the present invention inuse.

DETAILED DESCRIPTION OF THE INVENTION

[0011] The perspective view and the cross-sectional view of the presentinvention are shown in FIGS. 1 and 2, respectively. The presentinvention is applied in the field of testing jig for the semiconductorcomponents in the BGA packaging, wherein the testing jig retrieves theFCBGA base board and move it to the testing die, so as to conducttesting. The main structure includes a man jig body 1, wherein on thebottom of the main body 1 is provided with a retrieving head 2, which issmaller in size than the main body 1 and which is close to the baseboard 5. The main jig body is provided with an air inlet 11 on its top,and a plurality of air holes 21 are provided on the bottom of theretrieving head 2. The retrieving head 2 is also provided with aplurality of airways 22 internally, which are taken as air passages toconnect other objects and the main jig body, and thus to exert vacuumsucking force through the air holes 21 of the retrieving head 2, so asto retrieve the base board 5 for testing.

[0012] The main improvement of the present invention is to provide aconcave space 23 on the center of the bottom of the retrieving head 2,as shown in FIGS. 1-3. The shape of the space 23 is to correspond to thechip 51 located on the center of the base board 5, wherein the size ofthe space 23 slightly larger than the apparent size of the chip 51.Whereas, the four corners on the bottom of the retrieving head 2, whichare situated around the space 23, are provided with the plurality of airholes 21. When the main jig body 1 is to retrieve the base board 5 fortesting, the vacuum induced by the air holes 21 around the four comersof the retrieving head 2 can suck up the base board 5, wherein the chip51 on the center of the base board 5 is situated right at the emptyspace 23, without contacting with any other objects. While the bottom ofthe retrieving head 2 was pressing against the base board 5 duringtesting, no external force was exerted to damage the chip 51 andconsequently the success rate of production can be enhanced. The designcan also reduce the occurrence of the ESD, achieving the purpose ofpreventing static-electricity from occurring.

[0013] On the bottom of the main jig body 1 is additionally providedwith two buffer blocks 3 on opposite sides, whose main function is toprevent the base board 5 from pressing too low during testing, and thusavoid deforming the tin balls on the bottom. The thickness of the bufferblocks 3 can be changed according to the practical needs. Whereas, onthe bottom of the main body 1 is provided with the sockets 12 onopposite sides, forming the guiding holes 13, which can guide the wholeset into the correct position during the movement toward the testingdie, facilitating further testing work. The buffer blocks 3 and thesockets 12 are made of wear-resistant materials.

[0014] The exploded view of the testing die matched with the presentinvention in use is shown in FIG. 4. On the center of the die 4 isprovided with an accommodating space 41, wherein the retrieving head 2is located. On the bottom of the accommodating space 41 is provided witha plurality of probes 42, whose positions and number are to correspondto the plurality of connecting legs (tin balls). On both sides of theaccommodating space 41 of the die 4 are provided with a plurality ofprotruded pillars 43 so as to guide the main jig body 1 into the correctposition upon lowering process. In testing the base board 5, the mainjig body 1 sucks up the base board 5 to its bottom, lifting the chip 51to the empty space 23, and moves the chip 51 with the help of otherobjects to the place above the die 4. The main jig body 1 then slowlylowers with the protruded pillars 43, coming into the guiding holes 13,and the retrieving head 2 moves into the accommodating space 41 with theprobes 42 contacting the plurality of connecting legs on the bottom ofthe base board 5. Furthermore, the buffer blocks 3 are set against thetop of the die 4 so as to prevent the main jig body from lowering toomuch, thereby avoiding the deformation of the tin balls on the bottom ofthe base board 5. Consequently, during the process of retrieving ortesting, the chip 51 of the base board 5 will not be damaged byexternally applied forces or the contacts of foreign objects, andfurthermore reduce the probability of occurrence of the ESD, therebyenhancing the success rate of production.

[0015] It should be understood that the above only describes an exampleof one embodiment of the present invention, and that variousalternations or modifications may be made thereto without departing thespirit of this invention. Therefore, the protection scope of the presentinvention should be based on the claims described later.

What is claimed is:
 1. A testing jig for semiconductor components,mainly comprising a main jig body, wherein on its bottom is providedwith a retrieving head; on the center of the bottom of said retrievinghead is provided with a concave space, around which is arranged aplurality of air holes which are connected with internal airways andalso with an air inlet on the top of said main body; furthermore, on thebottom of said main jig body is provided with two buffer blocks onopposite sides, which can prevent said chip on the center of said baseboard from being contacted with external force or foreign objects in theprocess of retrieving said base board during testing.
 2. The testing jigfor semiconductor components as claimed in claim 1, wherein the size ofsaid concave space of said retrieving head is slightly larger than theapparent size of said chip.
 3. The testing jig for semiconductorcomponents as claimed in claim 1, wherein said four air holes aresituated on the four corners of the bottom of said retrieving head. 4.The testing jig for semiconductor components as claimed in claim 1,wherein on the bottom of said main jig body is additionally providedwith two buffer blocks on opposite sides.